: Typically indicates a need for process adjustment. Critical Defect Definitions

: When paste flows out or collapses after application. Integration with Automated Inspection (SPI)

: Major requirement is function of the completed assembly.

IPC-7527 provides specific thresholds for common printing errors. For example, is generally considered acceptable if the paste is centered within approximately 20% of the pad width , though Class 3 often requires tighter precision. Other critical defects covered include:

: Often seen in specific types of paste or print speeds.

: Requirements for the solder paste material itself. IPC-7527 Solder Paste Printing Standards | PDF - Scribd

While IPC-7527 is a visual standard, its criteria are the baseline for modern systems. SPI machines use lasers or cameras to measure height, volume, and area based on the thresholds defined in the standard. This combination of manual visual checks and automated measurement ensures 100% inspection coverage for high-reliability products. Where to Find the IPC-7527 PDF

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